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目前,手机已经超过所有的消费类电子产品,成为图像传感器的最大单一市场。我们正见证着光电子封装技术最引人注目的发展。Tessera主要因为闪存和存储器的封装而闻名,近来在收购了Shellcase公司和Digital Optics公司之后,Tessera迅速转向光电子封装,开发出一种世界上最薄的晶圆级芯片尺寸封装(Wafer-LevelChip-Scale Packaging,WLCSP)技术。这项技术的优点是采用聚合物密封的硅玻璃结构,能够保证透过实际的封装结构之后,仍然具有良好的图像传感能力。
At present, the mobile phone has surpassed all the consumer electronic products and becomes the largest single market of image sensor. We are witnessing the most dramatic development of optoelectronic packaging technology. Tessera is known for its flash memory and memory packages. Recently, with the acquisition of Shellcase and Digital Optics, Tessera quickly turned to optoelectronics packages to create one of the world’s thinnest Wafer-LevelChip-Scale Packaging, WLCSP) technology. The advantage of this technology is the use of polymer sealed silicon glass structure, to ensure that through the actual packaging structure, still has good image sensing capabilities.