论文部分内容阅读
在晶圆制造的良率维持、缺陷的侦测与再检查,目前的检测方法,很难提供高侦测感度,与高取样率,全芯片扫描,快速产能,并维持低成本。传统的检测方法,分别以高感度的明视场检查,与高产能的暗视场检查,无法再满足缺陷检查需求,特别是在大量晶圆产出的环境。在此,由力晶半导体提出创新的缺陷检查策略,即整合明视野暗视野检查机台,并最佳化,以使产出最大化,异常缺陷反应快速化等目标。
The wafer manufacturing yield maintenance, defect detection and re-inspection, the current detection method, it is difficult to provide high detection sensitivity, with high sampling rate, full chip scanning, fast throughput, and to maintain low cost. Traditional detection methods, respectively, with high sensitivity bright field inspection, and high-capacity dark field inspection, can no longer meet the defect inspection needs, especially in a large number of wafer output environment. Here, by the crystal semiconductor proposed innovative defect inspection strategy, that is, the integration of brightfield vision inspection machine, and optimization, to maximize output, rapid response to abnormal defects and other goals.