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残余应力直接影响修复件性能及尺寸稳定性,为降低修复应力,进行了低能量输入工艺参数组合及不同扫描路径的激光沉积修复GH4169合金试验研究。通过正交试验,研究了激光功率、扫描速度、送粉速度对沉积层熔高、熔宽、熔深以及热影响区宽度等特征尺寸的影响规律,采用低功率参数组合以及长边扫描路径与短边扫描路径,进行盲槽损伤试样的激光沉积修复,并检测分析了基体残余应力的分布情况。试验表明,相比1 400 W高功率参数,采用600 W低功率参数的修复试样残余应力明显减小,σx的平均降幅为48MPa,降低14.0%;σy的平均降幅为105MPa,降低37.8%;与长边扫描修复相比,短边扫描修复的残余应力略低,σx降低了25 MPa,降低7.8%,σy降低了38 MPa,降低18.0%。试验结果表明,采用低功率参数组合和短边扫描路径有利于降低激光沉积修复GH4169合金的残余应力。
Residual stress directly affects the performance and dimensional stability of the repaired parts. In order to reduce the repairing stress, experimental study on GH4169 alloy with low energy input process parameters and laser deposition of different scan paths was carried out. The effects of laser power, scanning speed and feeding speed on the feature sizes of deposition height, melting width, penetration depth and heat affected zone width were studied by orthogonal experiments. The combination of low power parameters and long-side scanning path Short-side scan path, laser deposition repair blind blind damage samples, and test the distribution of residual stress in the matrix. The experimental results show that the residual stress of the repaired specimen with low power of 600 W is obviously reduced compared with that of 1 400 W high power. The average decrease of σx is 48 MPa, a decrease of 14.0%. The average decrease of σy is 105 MPa, a decrease of 37.8%. Compared with the long-side scan repair, the residual stress of short-side scan repair is slightly lower, σx is reduced by 25 MPa, 7.8% lower, σy reduced by 38 MPa and 18.0% lower. The experimental results show that the combination of low power parameters and the short-side scan path can reduce the residual stress of laser repaired GH4169 alloy.