SMT的稳定发展促进了焊接后留下极少量残余物的焊剂的研究开发工作的进行,这类化学产品已应用在通用药心焊条和焊膏中,焊接后仅留下极少量的无害残余物,从而取消了清洗过程。在开发这类以合成树脂为主的无卤化物的低固体焊剂中首先要考虑的问题是产品的长期可靠性。这些新开发的材料结合许多旧产品用于焊接工艺,与许多技术规范相符合,但也有一些变化。技术规范的一些变化已在国际上引起许多问题,所以国际焊接机构和国际标准化组织规定了焊剂的分类和性能测试方法,这些规定是新标准和新产品的基础。表1 是国际焊接协会提出的焊剂分类表。这个 The steady development of SMT has contributed to the research and development efforts of fluxes that leave a very small amount of residues after soldering, which have been used in universal drug electrode and solder paste, leaving only a trace amount of innocuous residue after soldering Objects, thus eliminating the cleaning process. The first issue to be considered in the development of such a low-solid, halide-free, synthetic resin-based flux is the long-term reliability of the product. These newly developed materials, in combination with many older products, are used in the welding process, in line with many technical specifications, but with some changes. Some changes in the technical specifications have caused many international problems. Therefore, the International Welding Agency and the International Organization for Standardization have specified flux classification and performance testing methods, which are the basis for new standards and new products. Table 1 is the flux classification table proposed by the International Welding Society. This one