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据《Semiconductor World》Vol.20,№.12上报道,ST Assembly Test Services(STATS)与 Elip Chip Technologies(FCT)二公司签定了封装技术合同。按照该合同,STATS 公司可把 FCT 的凸点制作技术[Flex-On-Cap(FOC)]和再布线工艺应用于本公司的倒装芯片封装中。
According to “Semiconductor World” Vol. 20, No. 12, ST Assembly Test Services (STATS) and Elip Chip Technologies (FCT) II have signed a package technology contract. Under the contract, STATS can apply FCT’s bump fabrication technology [Flex-On-Cap (FOC)] and rewiring technology to the company’s flip chip package.