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近几年来,在无氰镀铜工艺中,由于对工艺的适应性要求越来越高,国内先后成功地研制了大量的多种类型的镀铜方法。除常规镀铜工艺外,还相继出现了不少光亮镀铜工艺。这些工艺由于各有其优点,都已在国内获得了广泛的应用。根据我们现有的条件,我们采用了乙二胺为络合剂的镀铜工艺。但是,在试验中,我们发现镀层因孔隙率过高而影响质量的问题。众所周知,有孔隙的镀层用于防渗碳是绝对不适宜的。由于限于条件,改用其它工艺亦不可能,在这种情况下,我们经过反复试验,终于成功地找到了用硝酸调整溶液可以避免孔隙而达到其它指标的方法,顺利地投入了生产。
In recent years, in the cyanide-free copper plating process, a large number of various types of copper plating methods have been successfully developed in China due to the increasing requirements for the adaptability of the process. In addition to conventional copper plating process, there have been many bright copper plating process. Because of their merits, these processes have been widely used domestically. Based on our existing conditions, we adopted a copper plating process using ethylenediamine as a complexing agent. However, in the experiments, we found that the quality of the coating due to porosity is too high. It is well known that the use of porosified coatings for carburizing is absolutely unfavorable. Due to limited conditions, the switch to other processes is impossible, in this case, after repeated experiments, we finally successfully found the solution can be adjusted with nitric acid to avoid porosity and achieve other indicators of the method, successfully put into production.