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在分析抛光硅片表面沾污类型的基础上,对目前硅片主要清洗方法的工作原理、清洗效果、适用范围等特点进行研究,重点研究硅片激光干法清洗原理和特点。
Based on the analysis of the type of contamination on the surface of polished silicon wafer, the working principle, cleaning effect and application range of the main silicon wafer cleaning methods are studied. The principle and characteristics of laser dry cleaning of silicon wafer are emphatically studied.