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用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题 .模拟时在芯片上表面中心预置一裂缝 ,计算芯片的应力强度因子和能量释放率 .模拟表明 ,由固化温度冷却到室温时 ,所研究的倒装焊封装在填充不流动胶时芯片断裂临界裂纹长度为 12 μm,而填充传统底充胶时为 2 0 μm.模拟结果显示芯片断裂与胶的杨氏模量和热膨胀系数相关 ,与胶的铺展关系不大 .焊点阵列排布以及焊点位置也会影响封装整体翘曲和芯片断裂 .
Fracture mechanics and finite element analysis were used to analyze the fracture of filled non-flowable plastic chips. A crack was preset in the center of the upper surface of the chip to calculate the stress intensity factor and energy release rate of the chip. The simulation shows that the solidification temperature is cooled to room temperature , The flip-chip package studied had a critical crack length of 12 μm when filled with no-flowing paste and 20 μm when filled with a conventional underfill. The simulation results show that the chip breaks with Young’s modulus and thermal expansion of the paste Coefficient correlation, and the relationship between the spread of glue is not large.Water array arrangement and solder joint location will also affect the overall package warpage and chip breakage.