利用蚀刻硅技术制造的微机械构件，由于特殊的制作工艺而需要对其材料的杨氏模量进行测量。这是随微机械技术的产生而提出的一个新课题。文章综述了已有的测量微机械材料杨氏模量的方法。在此基础上，提出了用声激励谐振法和瞬态激励法来测量微机械材料的杨氏模量，这两种方法具有测试装置简单、测量容易、精度高等特点。 Micromachined components made using etched silicon technology require the Young’s modulus of their material to be measured due to the particular manufacturing process. This is a new subject that comes with the development of micro-mechanical technology. The article reviews the existing methods of measuring the Young’s modulus of micromechanical materials. On this basis, it is proposed to measure the Young’s modulus of micromechanical materials by acoustic excitation resonance method and transient excitation method. These two methods have the advantages of simple testing device, easy measurement and high precision.