利用非等温DSC对o-碳硼烷双酚环氧树脂/4,4′-二苯砜二胺(DDS)以及m-碳硼烷双酚环氧树脂/DDS体系的固化反应过程进行了研究,并根据Kissinger方法求得体系固化反应的活化能分别为79.0和67.1 k J/mol,与E-51/DDS体系相比活化能较大,这归因于碳硼烷基团的大体积对环氧基团产生的位阻效应。根据Crane等方法计算得到体系固化反应级数分别为0.90和0.89。同时采用傅里叶红外光谱仪研究了碳硼烷环氧/DDS体系的等温固化反应,确定该体系的最佳固化条件为:180℃/2 h+200℃/2 h。 The curing reaction of o-carborane bisphenol epoxy resin / 4,4’-diphenyl sulfone diamine (DDS) and m-carborane bisphenol epoxy resin / DDS system was studied by non-isothermal DSC , And the activation energies of the system were found to be 79.0 and 67.1 kJ / mol, respectively, according to Kissinger’s method. The activation energies were higher than those of the E-51 / DDS system due to the large volume pairs of carborane groups The steric hindrance of epoxy groups. According to Crane and other methods calculated system curing reaction series were 0.90 and 0.89. At the same time, the isothermal curing reaction of carborane epoxy / DDS system was studied by Fourier transform infrared spectroscopy. The optimum curing conditions were determined as follows: 180 ℃ / 2 h + 200 ℃ / 2 h.