据《中国电子报》2009年7月9日报道,经国家发改委批准,以国内集成电路封测领军企业江苏长电科技股份公司为依托,联合中科院微电子研究所、清华大学微电子所,深圳微电子所、深南电路有限公司等5家机构,共同组建的我国首家“高密度集成电路封装技术国家工程实验室”,日前在位于无 According to “China Electronics News” reported on July 9, 2009, approved by the National Development and Reform Commission, the domestic IC packaging and testing leader Jiangsu Changdian Science and Technology Co., Ltd. as the backing, the joint Microelectronics Institute of Chinese Academy of Sciences, Tsinghua University Institute of Microelectronics, Shenzhen Microelectronics, Shennan Circuit Co., Ltd. and other five institutions jointly formed China’s first “high-density integrated circuit packaging technology National Engineering Laboratory”, a few days ago in the absence of