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近几年,集成电路尺寸和集成密度显著增大,检验设备已需要发展。缺陷探测和过程评价历来主要用光学显微镜。但由于放大率要求日益增大,用这种方法检验的区域逐渐缩小。其它自动化方法也不适用于目前和将来的晶片技术。全息检验对此提供了最佳解决方法,它具有快速的特点,能突出晶片表面主要部分的缺陷。
In recent years, integrated circuit size and integrated density significantly increased, testing equipment needs to be developed. Defect detection and process evaluation have traditionally used optical microscopy. However, due to the increasing requirements of magnification, the area examined by this method is gradually reduced. Other automated methods are not suitable for current and future wafer technologies. Holographic inspection provides the best solution to this, with fast features that highlight the major part of the wafer’s surface defects.