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一、概述航空电子设备中配置有各种功能的印制电路板。由于航空飞行器对电子设备的重量和体积有着严苛的要求,使得元器件在印制电路板上必须高密度地安装,从而使元器件在工作时产生大量聚集的热量,大大降低元器件的可靠性。因此,热设计是航空电子设备结构设计中必须重点解决的关键问题之一。当前所采用的冷却气流致冷方式一般分为三种形式,即冲击式,冷板式,空心板式。1.1 冲击式冷却气流直接冲击印制电路板的元器件表面将热量带走。这种冷却方式结
First, an overview of avionics equipped with a variety of functions printed circuit board. Because of the harsh requirements of aerospace vehicles on the weight and volume of electronic devices, components must be mounted on printed circuit boards at a high density, so that the components generate a large amount of heat at work and greatly reduce the reliability of the components Sex. Therefore, thermal design is one of the key issues that must be solved in the structural design of avionics. Currently used cooling airflow cooling methods are generally divided into three forms, namely impact, cold plate, hollow plate. 1.1 Impact cooling airflow direct impact on the printed circuit board components away from the heat. This cooling method knot