对于硅片来说,当在其上制作出集成电路芯片以前,一面要在硅片上复盖各种物质,一面将根据需要再度分步清除。作为复盖在硅片上的物质主要有下面几种:二氧化硅(氧化膜),SixNy(氮化硅膜)等绝缘体、多晶硅等半导体以及Al、MO等的金属导体。这些物质均是材料腐蚀对象。总的说来,光刻技术就是为了把这些物质层正确加工成所要求的微细图形 For a silicon wafer, before it is fabricated on an integrated circuit chip, the silicon wafer is covered with a variety of substances, which will be removed step by step as needed. There are mainly the following substances that are covered on the silicon wafer: insulators such as silicon dioxide (oxide film) and SixNy (silicon nitride film), semiconductors such as polycrystalline silicon, and metal conductors such as Al and MO. These materials are all corrosive materials. In general, photolithography is the correct processing of these layers of material into the required fine patterns