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本文介绍一种PCB基板材料,可以使材料保持强分子键力的环氧树脂,形成的结构中含有较少的极性基团如羟基或其他活性官能团,具有耐CAF性能,耐热性和较小的介电常数、介质损耗因数,适用于指定的网络设备中。另外,通过优化混合的无机填料的种类、形状、大小和加入量,可以减小热膨胀系数。通过改善填料的分散性,可以使材料保持良好的流动性及降低钻孔时的工具损耗。因为材料具有较低的厚度方向的热膨胀系数(Z-CTE)33×10~(-6)/℃,这种材料用于多层和厚板时具有优异的通孔连接的可靠性,380℃的高Td(热分解温度)允许材料适应无铅焊锡的高温,以上的性质使这种材料适用于高多层,更高传送速度和更高密度的PCB。
This article describes a PCB substrate material, the material can maintain a strong bond strength epoxy resin, the formation of the structure contains less polar groups such as hydroxyl or other reactive functional groups, with CAF resistance, heat resistance and more Small dielectric constant, dielectric dissipation factor, suitable for the specified network equipment. In addition, the coefficient of thermal expansion can be reduced by optimizing the type, shape, size and amount of the mixed inorganic filler. By improving the dispersibility of the filler, the material can maintain good fluidity and reduce tool wear during drilling. Because the material has a lower coefficient of thermal expansion (Z-CTE) of 33 × 10 -6 / ° C in the thickness direction, this material has excellent through-hole connection reliability when used in multi-layer and slab applications. The high Td (Thermal Decomposition Temperature) allows the material to accommodate the high temperature of lead-free solders, a property that makes this material suitable for high-multilayer, higher transfer speeds and higher density PCBs.