甚短距离光互连技术作为一种突破铜线互连传输瓶颈有效方法,受到了广泛关注。半导体光学器件技术、高速化集成电路技术和光电模块封装技术作为实现光互连的关键技术发展较为迅速。首先阐述了垂直腔面发射激光器的电路模型,然后针对光信号发送模块介绍了预加重补偿技术以及开环方式稳定光功率输出技术,并对如何提高光信号接收模块带宽性能的电路技术进行了分析。其次结合光互连模块技术标准的发展,以NEC公司的实用化甚短距离并行光互连模块为例,对其光电封装技术进行了说明,最后就甚短距离光互连技术所面临的课题及发展前景进行了总结。 Very short-distance optical interconnection technology as an effective way to break through the bottleneck of copper interconnect transmission has received widespread attention. Semiconductor optics technology, high-speed integrated circuit technology and optoelectronic module packaging technology as a key technology to achieve optical interconnection development more rapidly. Firstly, the circuit model of vertical cavity surface emitting laser is described. Then, the pre-emphasis compensation technique and the open-output stable optical power output technique are introduced for the optical signal transmitting module, and the circuit technology of how to improve the bandwidth performance of the optical signal receiving module is analyzed . Secondly, combined with the development of optical interconnection module technology standards, taking NEC’s practical and very short distance parallel optical interconnection module as an example, the optoelectronic packaging technology is described. Finally, the problems faced by very short-distance optical interconnection technology And development prospects are summarized.