本文提出了一种基于PDMS(聚二甲基硅氧烷)基底的芯片电极多层互连方法,应用MEMS(微电子机械系统)技术将芯片和电极进行了芯片级的互连,系统集成度高,尺寸小。相比传统的单层互连方法,在相同面积上互连电极数多。并且使用PDMS作为基底材料,大大降低了传统的以硅为基底的加工成本。制备的芯片电极多层互连系统芯片和电极互连数量多,各层绝缘层为绝缘性能良好的柔性Parylene(聚对亚苯基二甲基)薄膜,为柔性多层高密度线路互连技术提供了一种新方法。 In this paper, we propose a chip electrode multilayer interconnection method based on PDMS (polydimethylsiloxane) substrate. The chip and electrode are interconnected by MEMS (Micro Electro Mechanical System) technology at the chip level. The system integration High, small size. Compared with the traditional single-layer interconnection method, in the same area of ​​the interconnection electrode number. And using PDMS as the substrate material greatly reduces the traditional silicon-based processing costs. The prepared chip electrodes have a large number of interconnections between the chip and the electrodes of the multi-layer interconnection system chip, and each layer of the insulating layer is a flexible Parylene (parylene) film with good insulation properties, and is a flexible multilayer high-density line interconnection technology Provide a new method.