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随着PCB制作工艺向高密度精细化发展,以及PCB行业清洁生产的需要,传统的热风整平工艺受到挑战。本文对新型PCB表面终饰技术进行分析比较。
With the PCB manufacturing process to the development of high-density refinement, and PCB industry needs of cleaner production, the traditional hot air leveling process is challenged. This article analyzes and compares the new PCB surface finishing technology.