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2006年3月19日,Teradyne公司宣布,全球最大的半导体制造商之一中芯国际集成电路制造有限公司已经选择了UltraFLEXTM测试系统,用于大规模晶圆测试。 UltraFLEX测试系统将用于测试,包括音频、基带、 HDTV、高速通讯、数字接口和嵌入式内存产品等。
March 19, 2006 Teradyne Corporation announced that SMIC, one of the world’s largest semiconductor manufacturers, has selected the UltraFLEX ™ test system for large-scale wafer testing. The UltraFLEX test system will be used for testing, including audio, baseband, HDTV, high-speed communications, digital interfaces and embedded memory products.