在半导体生产过程中,半导体基片在生长制作时表面会存在一些细微突起的结构,这些突起的尺寸通常为微米量级,若突起的尺寸过高,在流水线上被打磨抛光时极易产生不合格的产品,从而影响生产效率。因此,需对平面上单一(或几个稀疏分布的)非球形粒子的高度进行实时在线测量。针对这一问题提出了一种测量微小粒子高度的方法:显微投影法。介绍了基于显微投影法的微小粒子高度测量系统,实现了约100μm高度的单一不规则形状微小粒子的测量。 In the semiconductor manufacturing process, the semiconductor substrate in the growth of the surface there will be some slight protrusions on the structure, the size of these protrusions are usually on the order of microns, if the protrusion is too high, polished in the pipeline is extremely easy to produce Qualified products, thus affecting the production efficiency. Therefore, real-time on-line measurements of the height of single (or sparsely distributed) non-spherical particles in the plane are required. Aiming at this problem, a method of measuring the height of tiny particles is proposed: the microscopic projection method. The micro particle height measurement system based on the microscopic projection method is introduced to measure the single irregular shape fine particles with a height of about 100 μm.