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随着半导体器件向高性能、高集成度发展,工艺技术就起着极其重要的作用。本文准备概述一下目前半导体制造工艺中所使用的材料,叙述一下几项有关的技术问题及今后展望。总的说来,虽然可统称为工艺中用的材料,但其种类甚多,欲将其全部均包罗在一个有限的范围之内,是不可能的。根据实际情况,也有时使用特殊材料。但比较常用的材料若按各工艺均加以分类,那末就如附表所示那样。附表中所说的直接材料是
As semiconductor devices to high-performance, highly integrated development, technology plays an extremely important role. This article is prepared to provide an overview of the materials used in the current semiconductor manufacturing process and to describe a few related technical issues and their outlook for the future. In general, although collectively referred to as the materials used in the process, there are many different types of material, and it is not possible to encompass all of them in a limited range. According to the actual situation, sometimes using special materials. However, if the most commonly used materials are classified according to each process, then as shown in the attached table. The direct material mentioned in the schedule is