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在Sn-0.7Cu-0.3Ni焊料的基础上,掺加不同比例的Ag元素,形成(Sn-0.7Cu-0.3Ni)-xAg系合金,研究不同的Ag掺量对Sn-0.7Cu-0.3Ni的熔化温度、润湿性及焊接接头微观组织的影响。结果表明,随Ag掺量的增加,能够降低其熔点,但这个体系的熔点普遍较高;随Ag掺量的增加,体系的润湿性能变好,但不明显;随Ag掺量的增加,界面化合物层的厚度逐渐增大,起伏逐渐变小而呈平坦的连续相。
On the basis of Sn-0.7Cu-0.3Ni solder, different proportions of Ag were added to form (Sn-0.7Cu-0.3Ni) -xAg alloys. The effects of different Ag contents on Sn-0.7Cu-0.3Ni The melting temperature, wettability and weld joint microstructure. The results show that with the increase of Ag content, the melting point can be decreased, but the melting point of this system is generally high. With the increase of Ag content, the wettability of the system becomes better, but not obvious. With the increase of Ag content, The thickness of the interfacial compound layer gradually increases, and the undulations gradually become smaller and form a flat continuous phase.