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高体积分数SiC_p/Al复合材料作为电子封装材料使用日益流行,其钎焊具有重要的实际意义。近来,一些新钎料合金和工艺被开发用于高体积分数SiC_p/Al复合材料的钎焊。本文回顾了SiC_p/Al复合材料的物理力学性能和制备工艺,综述了应用于高体积分数SiC_p/Al复合材料的合金钎料、钎焊工艺及其接头微结构与性能,旨在进一步理解它们之间的关联性,以优化接头性能与可靠性。往Al-Si合金中添加Cu、Mg、Ni等合金元素有助于提高钎料合金和钎焊接头的使用性能,如可优化钎料合金的应用温度、接头界面结合和焊缝强度。而表面金属化和超声波振动两种钎焊辅助工艺可通过避免或去除复合材料表面的Al_2O_3和SiO_2氧化膜来改善合金钎料的钎焊性。最后指出,需要进一步加强对合金钎料的优化设计、表面金属化工艺以及焊料/涂层/基材体系之间的润湿性和界面行为的研究。
The high volume fraction SiC_p / Al composite material is increasingly popular as an electronic packaging material, and its brazing has an important practical significance. Recently, some new solder alloys and processes have been developed for the brazing of high volume fraction SiC_p / Al composites. In this paper, the physical and mechanical properties and preparation techniques of SiCp / Al composites are reviewed. The alloy brazing filler metal, brazing process and the microstructure and properties of the joints are reviewed in order to further understand their Between the relevance, in order to optimize the connector performance and reliability. Addition of alloying elements such as Cu, Mg and Ni to Al-Si alloys can improve the serviceability of solder alloys and brazed joints, such as the optimum application temperature of brazing alloy, joint interface and weld strength. However, both the surface metallization and the ultrasonic vibration assisted brazing process can improve the solderability of the alloy brazing filler metal by avoiding or removing the Al 2 O 3 and SiO 2 oxide films on the composite surface. Finally, it is pointed out that there is a need to further strengthen the research on the optimum design of the alloy solder, the surface metallization process and the wettability and interface behavior between the solder / coating / substrate system.