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调焦调平测量系统(FLMS),实时测量硅片曝光视场区域与投影物镜焦面的相对位姿,其测量准确度影响光刻机曝光成像质量。调焦调平测量采用大入射角将3个以上的探测光斑投影到硅片曝光视场区域实现对硅片高度和倾斜的测量。如果光斑位置存在误差,就会引起硅片测量准确度误差,进而造成硅片曝光视场区域离焦,影响曝光成像质量。根据调焦调平单点几何测量模型,建立了光斑位置误差模型。研究结果表明,调焦调平单光斑的测量高度误差与光斑水平位置误差成正比,经调整调焦调平的零平面与焦面近似平行,并精确校准光斑水平位置误差到0.05 mm,其造成的测量误差最大为10 nm。
Focus leveling measurement system (FLMS), real-time measurement of wafer exposure field of view and projection lens focal plane relative pose, the measurement accuracy of exposure lithography machine imaging quality. Focus leveling measurement Large angle of incidence will be more than 3 projection spot projected to the silicon exposure field of view of the wafer height and tilt measurements. If there is an error spot location, it will cause the silicon measurement accuracy error, resulting in wafer exposure FOV field of view, affecting the quality of exposure imaging. According to the single point geometric measurement model of focusing and leveling, a spot position error model was established. The results show that the measurement height error of the single focus spot is proportional to the position error of the spot, the zero plane adjusted by the focus leveling is approximately parallel to the focal plane, and the horizontal position error of the spot spot is precisely calibrated to 0.05 mm The measurement error is up to 10 nm.