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本文首先从国内外的发展现状,概述了印刷电路板缺陷焊点的几种检测手段。并着重介绍了作者与其同事们正在研制的激光全息印刷电路板焊点缺陷自动检测系统。
In this paper, first of all, from the development status at home and abroad, outlines several testing methods of PCB solder joints. The author mainly introduces the automatic detection system of solder joint defect of laser holographic printed circuit board that the author and his colleagues are developing.