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针对应用于电子芯片的矩形通道翅片散热器换热性能的不足,提出了一种新型打断翻折型翅片散热器,并对两种散热器单通道内的流动换热进行CFD数值模拟。本文综合分析了f、j、无量纲因子(j/f)1/3和δ等参数,证明了打断和翻折翅片可以减薄边界层厚度、促进流体扰动和强化对流换热的效果。根据场协同理论和广义温度梯度均匀化原则,深层挖掘强化换热的内在规律;证明新型结构优于矩形结构,为用散热器冷却电子芯片提供了参考。
Aiming at the shortcomings of the heat transfer performance of rectangular channel finned heatsink used in electronic chips, a new type of finned finned finned heatsink is proposed. The CFD numerical simulation of the flow heat transfer in the single channel of the two kinds of heatsinks is presented . In this paper, the parameters of f, j, dimensionless factors (j / f) 1/3 and δ are comprehensively analyzed. It is proved that the effect of breaking and folding the fin can reduce the thickness of the boundary layer, promote the fluid disturbance and enhance the convective heat transfer . According to the field synergy theory and the principle of uniform temperature gradient homogenization, the inherent law of enhanced heat transfer is deeply tapped. The new structure is proved to be superior to the rectangular structure, which provides a reference for the radiator to cool the electronic chip.