根据国内外电子和微电子行业封装专业的研究和发展趋势 ,为了跟踪世界研究轨迹 ,促进我国封装专业技术水平的提高和生产技术的发展 ,由中国电子学会封装专业委员会和信息产业部电子第五十八研究所联合创办《电子与封装》(暂名 )刊物 ,为中国电子学会封装专业委员会会刊。她是国 According to the research and development trend of packaging specialty at home and abroad in electronics and microelectronics industry, in order to keep track of the world research track and promote the improvement of packaging technology in our country and the development of production technology, China Electronics Society Packaging Professional Committee and Ministry of Information Industry Electronics Fifth Eighteen Institute co-founded the “Electronics and Packaging” (tentative name) publications, Packaging Society of China Electronics Professional Committee Journal. She is a country