论文部分内容阅读
We have developed an alkaline barrier slurry(named FA/O slurry) for barrier removal and evaluated its chemical mechanical planarization(CMP) performance through comparison with a commercially developed barrier slurry.The FA/O slurry consists of colloidal silica,which is a complexing and an oxidizing agent,and does not have any inhibitors.It was found that the surface roughness of copper blanket wafers polished by the FA/O slurry was lower than the commercial barrier slurry,demonstrating that it leads to a better surface quality.In addition,the dishing and electrical tests also showed that the patterned wafers have a lower dishing value and sheet resistance as compared to the commercial barrier slurry.By comparison,the FA/O slurry demonstrates good planarization performance and can be used for barrier CMP.
We have developed an alkaline barrier slurry (named FA / O slurry) for barrier removal and evaluating its chemical mechanical planarization (CMP) performance through comparison with a commercially developed barrier slurry. The FA / O slurry consists of colloidal silica, which is a complexing and an oxidizing agent, and does not have any inhibitors. It was found that the surface roughness of copper blanket wafers polished by the FA / O slurry was lower than the commercial barrier slurry. demonstrating that it leads to a better surface quality. , the dishing and electrical tests also showed that the patterned wafers have a lower dishing value and sheet resistance as compared to the commercial barrier slurry.By comparison, the FA / O slurry demonstrates good planarization performance and can be used for barrier CMP.