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由于铜线较之金线明显节约成本,所以对铜(Cu)线键合的关注日益增长。但是,对铜线易腐蚀及封装可靠性的考虑推动产业开发替代材料。当前,敷钯铜(PdCu)线由于其改善了可靠性而已广泛使用。本文中,我们用0.6密耳PdCu线和裸铜线做实验。研究了PdCu烧球(FAB)的钯分布和晶粒结构。观测到电子灭火(EFO)电流和覆盖气体类型对钯分布有重大影响。测量了烧球(FAB)的硬度及与钯分布和晶粒结构的关系。对首次键合工艺响应作了定性研究。用高温存储测试研究了钯对线键合能力和线金属间键合的影响。PdCu线的这些结果与裸铜线进行了比较。
Due to the significant cost savings of copper compared to gold, there is increasing interest in copper (Cu) wire bonding. However, the consideration of copper corrosion and package reliability drives the industry in the development of alternative materials. Currently, PdCu wires are widely used because of their improved reliability. In this article, we experiment with a 0.6 mil PdCu wire and a bare copper wire. The palladium distribution and grain structure of PdCu burning ball (FAB) were investigated. The observed EFO current and the type of gas covered have a significant effect on the Pd distribution. The hardness of the baked ball (FAB) and the relationship with the distribution of palladium and the grain structure were measured. The first-time bonding process response was qualitatively studied. The effect of palladium on the bonding ability and the intermetallic bonding was investigated using a high temperature storage test. These results for the PdCu wire are compared to bare copper wire.