水稻育苗期间使用的漏板,是在厚度为0.3的钙塑板上冲出1066个圆形孔。(如图1),过去是将一副冲模通过更换定位距离分为几次冲成,这样不但效率低,而且操作极不方便。近年来随着用量的倍增,我们设计了一副一次冲1066孔的模具,经使用验证效果良好、提高效率好多倍。 The leak plate used during rice seedling raising is to punch out 1066 circular holes on the calcium plastic board with a thickness of 0.3. (Figure 1). In the past, a pair of dies were punched into several positions by changing the positioning distance. This not only was inefficient but also inconvenient in operation. In recent years, with the doubling of the amount, we designed a punch 1066 holes once the mold, the use of validated good results, improve efficiency many times.