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只用一步熔炼产出粗铜,较早以前就已可行,即使是对于低品位精矿也是如此。尽管有明显的优点,但是只有使用Cu/Fe比和Cu/S比足够高的专门物料,经济上才可行。目前有3个工厂采用奥托昆普粗铜闪速熔炼工艺,不远的将来另外3个工厂也将使用这种工艺。对于典型的黄铜矿精矿,有两个因素阻碍了直接炼粗铜工艺更广泛的应用:造渣及热量的产生。直接炼粗铜面临的一个挑战是含铜较高的炉渣对炉子耐火材料内衬的腐蚀。连续操作的奥托昆普粗铜直接闪速熔炼中,通过阻止熔体在沉淀池中的剧烈运动解决这一挑战。直接炼粗铜的这些挑战是从设备和工艺发展的观点来看的。本文介绍和讨论了克服这些障碍的新的解决办法。
It has been possible to produce blister copper in one step only, even for low-grade concentrates. Despite the obvious advantages, it is economically viable to use only specialized materials of sufficiently high Cu / Fe ratio and Cu / S ratio. There are currently three plants using Outokumpu blister flash smelting process, in the near future the other three factories will also use this process. For a typical chalcopyrite concentrate, there are two factors that hinder the broader use of direct flotation processes: slagging and heat generation. One of the challenges with direct blistering is the corrosion of furnace refractory linings with higher copper content. Continuous operation of Outokumpu blister direct flash smelting, to solve this challenge by preventing the melt in the sedimentation tank strenuous exercise. These challenges of direct blistering are seen from the standpoint of equipment and process development. This article describes and discusses new solutions to overcome these obstacles.