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4 在化学镀锡上的LDI 这是指经制备的在制板铜箔上涂覆上一层厚度为0.8/μm的锡箔,接着通过UV激光蚀去不需要的锡镀(涂)层及其底下的铜箔厚度3～5μm所形成的图形,最后以锡层为抗蚀剂进行碱性蚀刻(如常规的碱性CuCl_2蚀刻液),便可得到所期望的精细导体图形。
4 LDI on Electroless Tin Plating This refers to the preparation of a prepared copper foil on a copper foil with a thickness of 0.8 / μm tin foil, followed by UV laser etching away unnecessary tin plating (coating) layer and its Under the copper foil thickness of 3 ~ 5μm formed by the pattern, and finally with the tin layer as a resist alkaline etching (such as conventional alkaline CuCl_2 etching solution), can be expected to fine conductor patterns.