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采用平面丝网印刷工艺制备ＳｎＯ２厚膜气敏试样，分别在不同烧结温度和保温时间下于空气中烧成，测量试样的灵敏度和稳定性，并通过复阻抗分析方法，研究ＳｎＯ２气敏元件烧结工艺和电性能的关系，探讨烧结工艺对敏感材料微结构的影响．结果表明，适当调整烧结工艺参数可以使元件既有较高的气体灵敏度又有良好的长期稳定性；复阻抗分析表明，随保温时间延长，试样的电阻－电抗曲线半圆弧的弥散角逐渐减小至零，说明适当延长保温时间使晶粒间界处的弛豫时间分布趋向一致，晶界处晶粒的接触形态以及开口气孔和缺陷的分布等更趋均一和稳定．
SnO2 thick film gas sensing samples were prepared by plane screen printing process. The samples were sintered in air at different sintering temperature and holding time. The sensitivity and stability of the samples were measured. Through the complex impedance analysis, Element sintering process and the relationship between the electrical properties of the sintering process on the sensitive material microstructure. The results show that proper adjustment of sintering parameters can make the components have high gas sensitivity and good long-term stability. The complex impedance analysis shows that with the increase of holding time, the dispersion angle of semicircular arc of the resistance-reactance curve gradually increases Decrease to zero, indicating that extending the holding time appropriately makes the relaxation time distribution at the grain boundaries consistent with each other. The contact morphology of grains and the distribution of open pores and defects are more uniform and stable.