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我厂生产的大型陶瓷真空电容器,其封接件直径为φ306mm,高为180mm,材料是无氧铜和95％Al_2O_3瓷,采用活性封接法。众所周知,无氧铜的线膨胀系数与95％Al_2O_3瓷的线膨胀系数相差很大,室温下无氧铜为16.6×10~(-6),95％Al_2O_3瓷为6.0×10~(-6),故为非匹配封接。为了达到牢固而致密的封接件,我们在生产中,采用释应力的平封结构,如图一所示。
I plant a large ceramic vacuum capacitor, the sealing member diameter φ306mm, height 180mm, the material is oxygen-free copper and 95% Al_2O_3 porcelain, the use of reactive sealing method. It is well known that the linear expansion coefficient of oxygen-free copper is quite different from the linear expansion coefficient of 95% Al 2 O 3 porcelain. The oxygen-free copper is 16.6 × 10 -6 at room temperature and 6.0 × 10 -6 at 95% Al 2 O 3 porcelain. , It is non-matching seal. In order to achieve a firm and dense seal, we use a stress-relieved, flat seal construction in our production, as shown in Figure 1.