半导体器件外引线断裂的分析

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一、前言半导体器件外引线断裂(生锈、断腿)多年来是电子工业器件生产中一个关键技术质量问题。由于生产工艺流程较长,工序较多,影响因素较复杂,任何一个工序的疏忽都会造成隐患。大大地降低了器件的上机率,严重地影响了整机的稳定可靠性。关于外引线的断裂问题,国内外有关方面进行了很多工作,观点很多。但对缺陷产生的 I. INTRODUCTION The breakage of the outer leads of semiconductor devices (rusty, broken legs) has been a key technical quality issue in the production of electronic industrial devices for many years. As the production process is longer, more processes, more complex factors, any one of the negligence process will cause potential problems. Greatly reducing the probability of the device, seriously affecting the stability of the whole machine reliability. Concerning the breakage of outer leads, there are many things that have been done at home and abroad. But for the flaws produced
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