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随着电子行业的发展,对IC封装过程中的Au丝变形提出越来越严格的要求,不能出现断Au丝、露Au丝以及Au丝与芯片接触的现象。基于Ansys/Workbench有限元分析软件,将流场与压力场进行耦合,针对在不同注塑压力下,对同一条带YOA2的Au丝进行应力变形分析,并且用X射线对封装后的模块进行检测。模拟结果与检测结果相比较表明:当注塑压力从6 MPa增大到8 MPa时,Au丝变形量只增大了16μm,而且Au丝变形与压力呈线性关系。采用X射线检测与CAE技术相结合,研究封装过程中Au丝受力变形,并提出相应改进方案,对改善Au丝变形具有一定意义。
With the development of the electronics industry, more and more strict requirements are put forward on the deformation of the Au wire during the IC packaging process, and the phenomenon of breaking the Au wire, the Au wire and the Au wire contacting the chip can not occur. Based on the Ansys / Workbench finite element analysis software, the flow field and the pressure field were coupled. Stress analysis of Au wire with YOA2 was carried out under different injection pressure. The packaged module was detected by X-ray. The simulation results show that when the injection pressure is increased from 6 MPa to 8 MPa, the deformation of the Au wire increases only by 16 μm, and the deformation of the Au wire has a linear relationship with the pressure. The combination of X-ray detection and CAE technology was used to study the deformation of the Au wire during the packaging process and to propose the corresponding improvement scheme, which is of great significance to the improvement of the Au wire deformation.