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采用冷拉拔方法制备了高强高导Cu-Cr合金导线,考察了合金界面结构随拉拔变形量的演变,探讨了界面结构变化与合金性能的关系.结果表明,随变形量增大,Cu和Cr相均被逐渐拉长成纤维状,且两相的晶面之间逐渐趋于(111)Cu//(110)Cr,Cu/Cr界面由非共格关系演变为共格关系,同时,通过Cu/Cr界面的互扩散增强.界面密度的增加是导致电阻率随变形量增加持续增大的主要因素.界面共格化是造成合金强度增大并趋于恒定的原因.
The high-strength and high-conductivity Cu-Cr alloy wires were prepared by cold-drawing method, the evolution of the interface structure of the alloy with the drawing deformation was investigated, and the relationship between the interfacial structure changes and the properties of the alloy was discussed.The results show that with the increase of deformation, And Cr phase are gradually elongated into fibrous, and the interface between the two phases gradually tends to (111) Cu // (110) Cr. The Cu / Cr interface evolves into a coherent relationship from the non-coherent relationship, , Which is enhanced by interdiffusion of Cu / Cr interface.The increase of interfacial density is the main factor that leads to the increase of resistivity with the increase of deformation.The interface coalescence is the reason that the strength of alloy increases and tends to be constant.