在 AuCu 合金中实验表示有序化的时率随无序化温度升高而加快。就是说在库诺夸夫点以上无序化的温度越高,则在库诺夸夫点以下一个温度有序化的时率越快。这是可以理解的,如果在高温淬火时炼结下来的空穴对于有序化起作用,无序化温度越高,炼结下来的空穴越多,所以有序化时率越大。但是在Cu_3Au 合金中,现象就似乎完全不同。从库诺夸夫 Experiments in AuCu alloys show that the rate of ordering increases as the temperature of the disordering increases. That is to say, the higher the temperature of the disorder above the Kunodauquard point, the faster the rate of the next temperature ordering below the Kunodauquard point. This is understandable. If the holes formed during the high-temperature quenching work on the ordering, the higher the ordering temperature, the more cavities will be formed and the higher the ordering will be. However, in the Cu_3Au alloy, the phenomenon seems completely different. From Cunuchov