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本文介绍了印刷电路板的热风整平机中的最大部件－“锡槽”中的隔热层（硅酸铝纤维板）与外壳（1Cr18Ni9Ti）的联接形式由铆接改为粘接工艺后，不但简化了联接形式和减少工作量和劳动强度，且大幅度降低生产成本。
This article describes the printed circuit board hot air leveler in the largest part - “Tin” in the insulation layer (aluminum silicate fiberboard) and the shell (1Cr18Ni9Ti) of the joint form of riveting changed to the bonding process, not only simplified The connection form and reduce the workload and labor intensity, and significantly reduce production costs.