据《信学技报》(日)2010年110-14期报道,日本NTT公司开发了3D结构的准毫米波RF前端MMIC。该3D MMIC尺寸为3mm×3mm。发射采用上变频器,IF频带和RF频带分别具有增益控制功能,共为20dB发射功率控制;接受采用低成本的3GHz VCO,将其输出功率进行倍频。倒装封装后的MMIC测试结果,IF? According to “Letters Science and Technology” (Japan) 2010-11 period of 2010 reported that Japan’s NTT company developed a 3D structure quasi millimeter wave RF front-end MMIC. The 3D MMIC size is 3mm × 3mm. Launch the use of upconverter, IF band and RF band gain control, respectively, a total of 20dB transmit power control; accept the use of low-cost 3GHz VCO, the output power to multiply. After the flip-chip package MMIC test results, IF?