大阪大学S.Namba教授等人研究出一种能高速进行精细加工而不损坏基片的新激光蚀刻法。该法利用了可见氩离子激光照射时四氯化碳(一种反应气体)和基片表面间所发生的“光泵热化学反应”。据称这种方法成本低,无须掩模即可加工细的布线图案,速度比用紫外准分子激光快三个数置级。新激光蚀刻的试验装置仅由对基片加料的真空室、激光光源和通过小孔对基片照射的扫描器以及测量仪组成。真空室充以约70托(约为大气压的 Professor S.Namba of Osaka University and others developed a new laser etching method that can perform fine processing at high speed without damaging the substrate. This method utilizes the “optical pump thermochemical reaction” that occurs between carbon tetrachloride (a reactive gas) and the substrate surface during visible argon ion laser irradiation. Allegedly low cost of this method, without the mask can be processed fine wiring patterns, the speed faster than the use of ultraviolet excimer laser faster than three levels. The new laser-etching test set consists of a vacuum chamber for feeding the substrate, a laser light source, a scanner for illuminating the substrate through the orifice, and a gauge. The vacuum chamber was filled with about 70 torr (about atmospheric pressure