通信集成电路供应商IDT(Integrated Device Technology, Inc.)发布业界首款具有最高密度的32 K×32 K时隙交换(TSI)交换芯片。新产品承袭了IDT现有TSI交换芯片的优越性能,可提供一系列先进功能,使器件可作用于速度不同的各种器件,如数字信号处理器(DSPs)、成帧器、交换器等。新产品还包括使设置更加简便的组群存储器编程功能。与某些同类竞争产品不同,新款大容量TSI交换芯片可支持可变延迟模式,可为延时 Integrated Device Technology (IDT), a provider of communications integrated circuits, announces the industry’s first 32 K × 32 K time-slot switching (TSI) switch with the highest density. The new products inherit the superior performance of IDT’s existing TSI switch chips and provide a series of advanced features that allow the device to operate at a wide range of devices at different speeds, such as digital signal processors (DSPs), framer switches and switches. New products also include group memory programming features that make setup easier. Unlike some competing products, the new high-capacity TSI switch chip supports variable delay mode for latency