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在集成电路的设计鉴定、试验检定和故障分析时,了解到了各种造成特性异常的原因。其中,集成电路表面图形中的异常发热以及热分布不均匀都是问题。为了解决这种问题,研究了检测方法。集成电路表面热分布的测量非常困难,不能用直接接触法测量,所以尝试了涂上液晶来观测其变化,以及用红外探测器测量表面热辐射的方法。但目前都不能准确测量温度分布。尽管一般都认为红外测量是唯一有效的方法,但因为还有许多问题,所以其测量法的研究推迟了。那就是测量精度所包括的问题,其一是测量面的二维精度问题,再就是测量温度的精度。前者是由接收红外线的方法引起的,
In the design of integrated circuit identification test, test and fault analysis, learned a variety of causes of abnormal characteristics. Among them, abnormal heat and uneven heat distribution in the surface pattern of the integrated circuit are all problems. In order to solve this problem, the detection method was studied. It is very difficult to measure the heat distribution of the integrated circuit surface and can not be measured by the direct contact method. Therefore, an attempt has been made to apply a liquid crystal to observe the change and to measure the surface thermal radiation with an infrared detector. However, at present, the temperature distribution can not be accurately measured. Although infrared measurement is generally considered as the only effective method, its measurement has been postponed due to many problems. That is the measurement accuracy of the problems involved, one is the measurement of two-dimensional accuracy of the surface, and then is the measurement of temperature accuracy. The former is caused by the method of receiving infrared light,