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根据动能定理和薄板理论提出了一种新的脆性材料强度测试方法——圆片冲击法。通过当硅片较薄时偏离小挠度条件的实验校准，使该方法适用于各种厚度硅片的强度测量，进而制订了硅片抗弯强度测试方法的国家标准。
According to kinetic energy theorem and thin plate theory, a new brittle material strength testing method - wafer impact method was proposed. The method is suitable for the strength measurement of silicon wafers of various thicknesses by deviating from the experimental calibration of small deflection conditions when the silicon wafers are thinner, and then the national standard for testing the flexural strength of silicon wafers is formulated.