用以焦磷酸盐为络合剂的镀铜工艺来代替氰化镀铜工艺、国内外已使用多年。其优点是镀液稳定、结晶细致,但镀层结合力不好是其致命的缺点,因而推广受到限制。为了解决结合力的问题,国内外也研究过多种措施,如化学予浸、活化予镀、氰化予镀,予镀镍等。但结果不是结合力仍不理想,就是离不开氰化物。我们在焦磷酸盐镀铜前,先用HEDP活 Copper pyrophosphate as a complexing agent to replace the copper plating process of copper cyanide, both at home and abroad have been used for many years. The advantage is that the bath is stable, crystal fine, but the coating is not good combination of its fatal shortcomings, which promote the limited. In order to solve the problem of cohesion, many measures have been studied both at home and abroad, such as chemical impregnation, activation plating, cyanide plating, nickel plating and the like. However, the result is not satisfactory or not with the combination of cyanide is inseparable. We use HEDP before pyrophosphate copper plating