基于SOPC的非致冷红外热成像系统的研制

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针对传统基于DSP+FPGA/CPLD架构的红外热成像系统存在体积大、数据传输链路长、功耗大等缺点,提出一种基于片上可编程(SOPC)的非致冷红外热成像系统。利用SOPC定制NIOSⅡ软核处理器、存储控制器及外围电路等成像系统的硬件,并由NIOSⅡ软核实现红外图像的处理和显示,使系统软硬件高度集成在同一芯片内。与传统的红外热成像系统相比,基于SOPC的非致冷红外热成像系统具有体积小、功耗低、性能稳定的优点。 In view of the disadvantages of traditional DSP + FPGA / CPLD-based infrared thermal imaging system, such as large volume, long data transmission link length and large power consumption, a non-refrigeration infrared thermal imaging system based on on-chip programmable (SOPC) is proposed. SOPC custom NIOS Ⅱ soft-core processor, memory controller and peripheral circuits and other imaging system hardware, and by NIOS Ⅱ soft core infrared image processing and display, the system hardware and software are highly integrated in the same chip. Compared with the traditional infrared thermal imaging system, SOPC-based uncooled infrared thermal imaging system has the advantages of small size, low power consumption, stable performance.
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