日本学者对固态扩散焊界面空洞收缩机理进行了系列研究 :( 1)提出了二维界面几何模型 ;指出界面空洞收缩是在塑性变形、粘塑性变形、界面扩散及体积扩散四大机制作用下实现的 ;并估算了各机制的作用大小。( 2 )在基于空位扩散的界面扩散的数值计算中 ,考虑了因界面扩散引起的刚性位移及在不同接合率下的空洞间隔2L的变化 ;另外还研究了空洞表面扩散快慢对界面扩散的影响。 ( 3)首次提出了粘塑性变形机制的有限元模型 ,并发现在扩散焊后期拘束对空洞收缩速度有显著的抑制作用 Japanese scholars made a series of researches on the cavity shrinkage mechanism of solid-state diffusion welding interface: (1) Proposed a two-dimensional interface geometry model; point out that the cavity shrinkage is realized under the action of four mechanisms of plastic deformation, viscoplastic deformation, interface diffusion and volume diffusion ; And estimated the role of the mechanism size. (2) In the numerical calculation of interfacial diffusion based on vacancy diffusion, the rigid displacement due to interfacial diffusion and the change of cavity spacing 2L under different interfacial rates were considered. In addition, the influence of diffusion speed on the interfacial diffusion . (3) For the first time, the finite element model of viscoplastic deformation mechanism was proposed and it was found that the restraint had a significant inhibitory effect on the shrinkage rate of cavity at the later stage of diffusion welding