论文部分内容阅读
采用 Fe-Ni(重量比为 65∶ 3 5)金属粉末焊料 ,利用 Gleeble1 50 0热模拟机对镍基高温合金 ( GH1 2 8)和 Si C陶瓷进行反应连接 ,研究了连接温度、连接压力和高温保温时间对试样连接强度的影响 ,确定了最佳工艺参数 ,并制备了剪切强度超过 3 4 .3 MPa的陶瓷 /金属连接件。界面结构分析表明陶瓷 /焊料界面反应层的形成主要受 Fe,Ni原子向陶瓷中的扩散引起
The Ni-based superalloy (GH1 2 8) and Si C ceramics were reacted and connected using Fe-Ni (65:35 weight ratio) metal powder solder using a Gleeble150 0 simulator. The effects of connection temperature, bonding pressure and The influence of high temperature holding time on the connection strength of the sample was studied. The optimum technological parameters were determined and the ceramic / metal connectors with the shear strength over 34.3 MPa were prepared. Interface structure analysis shows that the formation of the ceramic / solder interface reaction layer is mainly caused by the diffusion of Fe and Ni atoms into the ceramic