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CBP3.0复合式SOC器件集成了一个全CDMA基带处理器,它将混合信号单元和数字IP单元集成在同一片IC中,达到了一个新的集成水平,这在将模拟单元引入到0.25微米工艺过程之前是不可能实现的。
CBP3.0 composite SOC device integrates a full CDMA baseband processor, which combines mixed-signal unit and digital IP unit in the same piece of IC, reached a new level of integration, this is the analog unit is introduced into the 0.25 micron process The process is impossible before.