建立了功率型LED结构,分析了其热阻模型,对采用高导热导电银胶、纳米银焊膏、大功率芯片键合胶、Sn70Pb30四种键合材料的LED进行了ANSYS有限元软件仿真对比研究。结果表明,纳米银焊膏具有最优的传热特性。采用了正向电压法对3W蓝光LED进行了热阻测量,其数值与仿真结果基本相符,验证了模拟仿真结果的真实性。 The power LED structure was established and its thermal resistance model was analyzed. The ANSYS finite element software simulation of LED with four kinds of bonding materials, such as high thermal conductive silver paste, nano silver solder paste, high power chip bonding adhesive and Sn70Pb30, the study. The results show that nano-silver solder paste has the best heat transfer characteristics. The forward voltage method was used to measure the thermal resistance of 3W blue LED. The numerical results agree well with the simulation results, which verify the authenticity of the simulation results.